Electronics Packaging Engineer - (US-IL-Rockford)
Electronics Packaging Engineer - (US-IL-Rockford)
Compensation: $80K - $100K / Year
Min Education: Bachelors
Job Type: Full Time
Jobcode: 52276SHJAExperience Required : 5 - 10 years
Degree Required : 4 Year Degree
PAID RELOCATION AVAILABLE
Responsible for all mechanical aspects of the electronics hardware packaging design for high technology aerospace products including electronic controllers, power conversion equipment, and power management / power distribution products.
Includes the mechanical design of leading edge power electronics equipment from conception through qualification; power interconnect and inductor / transformer design ; chassis design utilizing castings, brazements and sheet metal ; and the mechanical design / development of mixed signal printed wiring boards and flexible circuits. A well developed competency in mechanical design, heat transfer and structural analysis is required along with an in-depth understanding of manufacturing and cost implications. The successful candidate will be a highly motivated self starter with strong written and oral communication skills and work well in a team environment.
Candidate Must Have :
* Comfortable with hardware
* Heat transfer knowledge
* Mechanical design knowledge for electronics - box level/system level
Email resume in Word to thebigamehunter@cisny.com. Please include the job code for the position with your resume.
NO VISA TRANSFERS. NO OVERSEAS RESUMES. NO 3RD PARTIES.
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